EN規格準拠鉄道向け3U CompactPCI Plus IOボード
Intel® Intel® Kaby Lake-H mobile搭載
-40～85℃まで動作温度保証（On Request）
Humidity 5% ... 95% RH non condensing
Conformal Coating(Option)
Windows®, Linux and other (RT)OS'
●Intel® Kaby Lake-H mobile platform with ECC (CM238 mobile workstation PCH)
Xeon E3 1505M v6 3/4GHz4C/8T 45/35W
Xeon E3 1505L v6 2.2/3GHz 4C/8T 25W
●7th Generation Intel® Core™ mobile processor
i3 7100E • 2.9GHz 2C/4T 35W
i3 7102E • 2.1GHz 2C/4T 25W
●DDR4 +ECC soldered memory up to 16GB
●CompactPCI® PlusIO (PICMG® CPCI 2.30) System Slot Controller
●Form factor single size Eurocard (board dimensions 100x160mm2)
●Mounting height 3U
●+5V, +3.3V according to CompactPCI® 2.0 via J1 backplane connector
●Operating temperature 0°C to +70°C
●Operating temperature -40°C to +85°C (industrial temperature range) on request
●Storage Temperature: -40°C to +85°C
●Humidity 5% ... 95% RH non Condensing
●Altitude -300m ... +3000m
●Shock 15g 0.33ms, 6g 6ms
●Vibration 1g 5-2000Hz
●MTBF 21.2 years
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